Description
BUY SN74LVC2G02DCT3 https://www.utsource.net/itm/p/5104284.html
| Parameter |
Symbol |
Conditions |
Min |
Typ |
Max |
Unit |
| Supply Voltage |
VCC |
Operating |
1.65 |
|
5.5 |
V |
| Input Low Voltage |
VIL |
VI = 0 to VIL, TA = 25°C |
|
|
0.8 |
V |
| Input High Voltage |
VIH |
VI = VIH to VCC, TA = 25°C |
2.0 |
|
|
V |
| Output Low Voltage |
VOL |
IO = 4 mA, TA = 25°C |
|
|
0.1 |
V |
| Output High Voltage |
VOH |
IO = -4 mA, TA = 25°C |
|
|
VCC-0.1 |
V |
| Propagation Delay Time |
tpd |
VCC = 3.3V, TA = 25°C |
|
6.9 |
|
ns |
| Power Dissipation |
PD |
VI = 0V, VCC = 3.3V |
|
|
1.7 |
mW |
Instructions for SN74LVC2G02DCT3
Power Supply Connection:
- Connect the VCC pin to a power supply within the range of 1.65V to 5.5V.
- Ensure the GND pin is connected to ground.
Input Signal Handling:
- Apply input signals ensuring they meet the specified VIL and VIH levels for reliable operation.
- Avoid exceeding the maximum input voltage (VCC).
Output Signal Handling:
- The output can drive loads up to 4 mA for low-level outputs and sink up to 4 mA for high-level outputs.
- Check the VOL and VOH parameters to ensure compatibility with downstream components.
Propagation Delay:
- Account for the propagation delay time in timing-critical applications. At 3.3V, expect a typical delay of 6.9 ns.
Thermal Considerations:
- Monitor the power dissipation; at 3.3V supply, it should not exceed 1.7 mW under standard conditions.
Storage and Handling:
- Store in recommended conditions to avoid damage from electrostatic discharge (ESD).
- Handle with care to prevent mechanical damage.
Mounting:
- Follow standard surface-mount technology (SMT) practices for mounting on PCBs.
- Ensure proper soldering to maintain electrical integrity and thermal performance.
For detailed specifications and additional information, refer to the official datasheet provided by the manufacturer.
(For reference only)
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