MRF9030GN

MRF9030GN

Category: Available (Qty:9999999)
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Description

BUY MRF9030GN https://www.utsource.net/itm/p/9268777.html

Parameter Description
Part Number MRF9030GN
Type RF Power MOSFET
Package Type TO-247
Pulsed Drain Current (IDM) 150A Peak at TC = 25°C, Pulse Width ≤ 10μs, Duty Cycle ≤ 0.1%
Continuous Drain Current (ID) 30A at TC = 25°C
Gate Charge (Qg) 185nC at VGS = ±10V, IDS = 10A
Input Capacitance (CISS) 2280pF at VDS = 15V, f = 1MHz
Output Capacitance (COSS) 150pF at VDS = 15V, f = 1MHz
Reverse Transfer Capacitance (CRSS) 650pF at VDS = 15V, ID = 1mA
Drain-Source Voltage (VDS) 50V
Gate-Source Voltage (VGS) ±20V
Power Dissipation (PD) 150W at TC = 25°C
Thermal Resistance (RθJC) 0.45°C/W Junction to Case
Operating Temperature Range (TJ) -55°C to +175°C

Instructions for Use:

  1. Mounting and Handling:

    • Ensure proper heat sinking when mounting the device.
    • Handle with care to avoid damage to the gate terminal which is sensitive to ESD (Electrostatic Discharge).
  2. Biasing:

    • Apply gate-source voltage within the specified limits to prevent damage.
    • Ensure that the gate drive circuitry can supply sufficient current to charge/discharge the gate capacitance quickly.
  3. Heat Management:

    • Monitor operating temperatures closely. Exceeding the maximum junction temperature can lead to device failure.
    • Use thermal management techniques such as heatsinks or forced air cooling if necessary.
  4. Pulsed Operation:

    • For pulsed applications, ensure pulse width and duty cycle do not exceed recommended values to avoid overheating.
  5. Storage:

    • Store in a dry, cool environment away from direct sunlight and sources of heat.
    • Keep in original packaging until ready for use to protect against static discharge.
  6. Safety Precautions:

    • Always follow safe work practices when handling high-power devices.
    • Be aware of potential hazards associated with high voltages and currents.
(For reference only)

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