BSM75GB120DLC

BSM75GB120DLC

Category: Available (Qty:9999999)
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Description

BUY BSM75GB120DLC https://www.utsource.net/itm/p/12591464.html

Parameter Symbol Min Typ Max Unit Description
Blocking Voltage V(BR)DSS - 1200 - V Drain-Source Breakdown Voltage
Continuous Drain Current ID - - 75 A Continuous Drain Current at Tc=25°C
Power Dissipation Ptot - - 350 W Total Power Dissipation
Junction Temperature TJ -25 - 175 °C Operating Junction Temperature Range
Gate Charge Qg - 84 - nC Total Gate Charge
Input Capacitance Ciss - 6200 - pF Input Capacitance
Output Capacitance Coss - 1600 - pF Output Capacitance
Reverse Transfer Capacitance Crss - 1350 - pF Reverse Transfer Capacitance
RDS(on) @ ID = 25A, VGS = 15V RDS(on) - 0.075 - Ω On-State Resistance

Instructions for Use:

  1. Handling Precautions: The BSM75GB120DLC is sensitive to ESD (Electrostatic Discharge). Handle with care and use appropriate ESD protection measures.
  2. Mounting: Ensure proper thermal management by mounting the device on a suitable heatsink to maintain junction temperature within specified limits.
  3. Voltage Rating: Do not exceed the maximum blocking voltage (V(BR)DSS) of 1200V to prevent device failure.
  4. Current Handling: Operate within the continuous drain current (ID) limit of 75A to avoid overheating and potential damage.
  5. Gate Drive Requirements: Ensure the gate drive circuit can supply sufficient charge (Qg) as specified to switch the MOSFET efficiently.
  6. Capacitance Considerations: Account for the input (Ciss), output (Coss), and reverse transfer (Crss) capacitances in your circuit design, especially for high-frequency applications.
  7. Power Dissipation: Keep the total power dissipation (Ptot) below 350W to ensure reliable operation. Proper cooling methods may be necessary for higher power applications.
  8. Operating Temperature: Maintain the junction temperature (TJ) between -25°C and 175°C to ensure stable performance and longevity of the device.
(For reference only)

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