Description
BUY TGPF30N40P https://www.utsource.net/itm/p/12606529.html
Parameter |
Symbol |
Min |
Typical |
Max |
Unit |
Conditions |
Drain-Source On-State Resistance |
RDS(on) |
- |
0.24 |
- |
Ω |
VGS = 10V, ID = 10A |
Gate-Source Threshold Voltage |
VGS(th) |
2.0 |
- |
4.0 |
V |
ID = 250μA |
Continuous Drain Current |
ID |
- |
- |
30 |
A |
TC = 25°C |
Pulse Drain Current |
IGM |
- |
- |
90 |
A |
tp = 10ms, TC = 25°C |
Power Dissipation |
PD |
- |
- |
170 |
W |
TC = 25°C |
Junction Temperature |
TJ |
- |
- |
175 |
°C |
- |
Storage Temperature |
TSTG |
-55 |
- |
150 |
°C |
- |
Instructions for TGPF30N40P:
Installation:
- Ensure the device is handled with care to avoid damage from electrostatic discharge (ESD).
- Use appropriate heat sinks or cooling solutions if operating near maximum power dissipation.
Operating Conditions:
- Do not exceed the maximum ratings listed in the table.
- Maintain the junction temperature within specified limits to ensure reliable operation.
Gate Drive:
- Apply a gate-source voltage (VGS) of at least 10V to fully turn on the device and minimize on-state resistance.
- Avoid applying voltages outside the threshold range to prevent unintended operation.
Handling Pulses:
- For pulse operations, ensure the pulse duration does not exceed the specified limits to prevent thermal overload.
Storage:
- Store the device in a dry, cool environment within the storage temperature range to prevent degradation.
Safety Precautions:
- Always follow safe handling practices and consult the datasheet for detailed specifications and safety guidelines.
(For reference only)
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