BUY LD1970-LQFP https://www.utsource.net/itm/p/12607405.html
| Parameter | Description | Value/Range | Unit |
|---|---|---|---|
| Package Type | Lead Frame Molded Package | LQFP (Low-Profile Quad Flat Package) | - |
| Number of Pins | Number of electrical connections | 48 | - |
| Operating Temperature | Temperature range in which the device can operate safely | -40 to +125 | °C |
| Supply Voltage | Voltage range that powers the device | 2.7 to 5.5 | V |
| Quiescent Current | Current consumed by the device when not driving a load | 2.5 | mA |
| Output Current | Maximum current that can be supplied to a load | 300 | mA |
| Dropout Voltage | Voltage difference between input and output for regulation | 0.3 (at 300mA) | V |
| PSRR (Power Supply Rejection Ratio) | Ability to reject ripple from the power supply | 60 (at 1kHz) | dB |
| Load Regulation | Change in output voltage with respect to change in load current | ±0.2 | % |
| Line Regulation | Change in output voltage with respect to change in input voltage | ±0.1 | % |
Mounting: Ensure the LD1970-LQFP is mounted on a PCB with adequate thermal management, such as a heat sink or thermal vias, especially if operating at high currents or temperatures.
Power Supply: Connect the supply voltage within the specified range (2.7V to 5.5V). Ensure proper decoupling capacitors are placed close to the supply pins to stabilize the voltage.
Output Connections: Connect the load directly to the output pin. Ensure the total load current does not exceed 300mA to prevent overheating and damage.
Grounding: Provide a solid ground connection to the GND pin. A low impedance path helps in reducing noise and improving stability.
Thermal Considerations: Monitor the junction temperature to ensure it stays within the operational limits (-40°C to +125°C). Avoid placing the device in areas where airflow is restricted.
Testing: Before deploying in final applications, thoroughly test the device under expected operating conditions to ensure reliability and performance.
Storage and Handling: Store in a dry environment and handle with care to avoid electrostatic discharge (ESD) damage. Follow standard ESD handling procedures.
