BUY TLP222A https://www.utsource.net/itm/p/12607682.html
| Parameter | Symbol | Conditions | Min | Typ | Max | Unit |
|---|---|---|---|---|---|---|
| Forward Voltage | VF | IF = 10mA | - | 1.2 | 1.5 | V |
| Reverse Breakdown Voltage | VR | IR = 1mA | 5 | - | 7 | V |
| Forward Current | IF | Continuous | - | - | 30 | mA |
| Peak Pulse Current | IFT | t < 1ms | - | 100 | - | mA |
| Storage Temperature | Tstg | - | -40 | - | 85 | °C |
| Operating Temperature | Topr | - | -25 | - | 75 | °C |
Mounting Orientation: Ensure the device is mounted in the correct orientation as indicated by the pin configuration diagram provided in the datasheet.
Electrical Stress: Do not exceed the maximum ratings specified in the parameter table to avoid damage to the device.
Heat Dissipation: For applications involving high current pulses, ensure adequate heat dissipation to maintain operating temperatures within the specified range.
Handling Precautions: Handle the device with care to prevent electrostatic discharge (ESD) damage. Use proper ESD protection measures such as wrist straps and conductive packaging.
Testing and Inspection: Before incorporating into a circuit, verify the device parameters using a calibrated test setup to ensure compliance with specifications.
Storage Conditions: Store in a dry, cool place within the temperature limits specified to prevent degradation of performance characteristics.
Soldering: Follow the recommended soldering profile to avoid thermal shock which can lead to internal damage.
For detailed specifications and application notes, refer to the official datasheet of the TLP222A.
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