TC1427CPA

TC1427CPA

Category: Available (Qty:9999999)
For more information, visit our official website at utsource.us

Description

BUY TC1427CPA https://www.utsource.net/itm/p/12607845.html

Parameter Symbol Conditions Min Typ Max Unit
Supply Voltage VDD Operating 2.0 - 5.5 V
Output Low Voltage VOL IO = 4 mA, VDD = 5V 0.4 - - V
Output High Voltage VOH IO = -4 mA, VDD = 5V - - 4.6 V
Input Leakage Current IIL VIN = 0V to VDD, T = 25°C -1 - 1 μA
Propagation Delay Time tpd VDD = 5V, TA = 25°C 8 - 13 ns
Power Dissipation PD Per Package - 170 - mW
Operating Temperature TOPR -40 - 85 °C

Instructions for Use:

  1. Power Supply Requirements: The TC1427CPA operates within a supply voltage range of 2.0V to 5.5V. Ensure the power supply is stable and within this range to avoid damage or malfunction.

  2. Output Voltage Levels:

    • For logic low output (VOL), when sourcing up to 4mA, the output voltage should not exceed 0.4V.
    • For logic high output (VOH), when sinking up to -4mA, the output voltage should be at least 4.6V when VDD is 5V.
  3. Input Current: Keep the input leakage current within ±1μA to ensure reliable operation. Avoid excessive input currents that can affect performance.

  4. Propagation Delay: The device has a propagation delay of 8 to 13 nanoseconds under standard conditions (VDD = 5V, TA = 25°C). This is critical for timing considerations in circuit design.

  5. Power Dissipation: The maximum power dissipation per package is 170mW. Design the circuit layout to manage heat effectively, especially in compact designs or high ambient temperatures.

  6. Temperature Range: The operating temperature range is from -40°C to +85°C. Ensure the device operates within this temperature range to maintain reliability and performance.

  7. Handling Precautions: Follow proper handling procedures to prevent electrostatic discharge (ESD) damage. Use appropriate ESD protection measures during assembly and testing.

  8. Mounting and Layout: Ensure adequate spacing and cooling provisions in the PCB layout. Proper mounting techniques will help dissipate heat and reduce thermal resistance.

(For reference only)

More detail about Utsource Holding Company Limited
Utsource Holding Company Limited
Utsource Holding Company Limited Electronic Component Wholesaler, IC Chip Distributor, IGBT Module Supplier in California, USA | Utsource Holding Company Limited