K4H511638J-LCB3000: Top Choice in United States (USA) Utsource Holding Company Limited

Description

Parameter	Description
Device Type	512Mb DDR3 SDRAM
Package	FBGA (Fine Pitch Ball Grid Array)
Density	512 Mbit (64M x 8)
Voltage (Vcc)	1.35V / 1.5V
Operating Temperature Range	-40°C to +85°C
Data Rate	Up to 1600 MT/s
CAS Latency (CL)	11, 13
Row Address Strobe (RAS) Precharge Time (tRP)	13.125ns (CL=11), 15ns (CL=13)
Row Active to Row Active Delay (tRRD)	7.5ns (CL=11), 9ns (CL=13)
Refresh Cycle Time (tRFC)	64ms (CL=11), 64ms (CL=13)
Power Down Mode	Supports both self-refresh and deep power-down modes

Installation: Ensure the device is installed in a compatible motherboard slot that supports DDR3 memory standards.
Voltage Setting: Set the system voltage to either 1.35V or 1.5V as required by the system specifications.
Timing Configuration: Configure the memory timings according to the CAS latency supported by your system. Use the provided timing parameters for optimal performance.
Temperature Management: Operate within the specified temperature range to ensure reliable operation. Consider adequate cooling solutions if operating near the upper limit.
Power Management: Utilize the power down modes to reduce power consumption when the memory is not actively being used.
Compatibility: Verify compatibility with the system BIOS/UEFI settings to ensure proper initialization and configuration of the memory module.

(For reference only)