Description
BUY MC14040BCL https://www.utsource.net/itm/p/12608491.html
| Parameter |
Symbol |
Conditions |
Min |
Typ |
Max |
Unit |
| Supply Voltage |
VDD |
|
3.0 |
|
18 |
V |
| Operating Temperature |
|
|
-40 |
|
85 |
°C |
| Input Leakage Current |
II |
VIL = 0 to VDD |
-1.0 |
|
1.0 |
μA |
| Output Low Voltage |
VOL |
IO = 16 mA, TA = 25°C |
0.4 |
|
|
V |
| Output High Voltage |
VOH |
IO = -4 mA, TA = 25°C |
|
|
VDD-2.5 |
V |
| Propagation Delay Time |
tpd |
VDD = 10V, TA = 25°C |
70 |
|
|
ns |
| Power Dissipation |
PD |
|
|
180 |
|
mW |
Instructions for MC14040BCL
Power Supply:
- Ensure the supply voltage (VDD) is within the specified range of 3.0V to 18V to avoid damage to the device.
Temperature Considerations:
- The operating temperature range is from -40°C to +85°C. Ensure that the device is used within this range to maintain reliability and performance.
Input Handling:
- Keep input leakage current within ±1.0 μA to prevent potential operational issues or data corruption.
Output Levels:
- For output low voltage (VOL), ensure it does not exceed 0.4V when sourcing 16mA at 25°C.
- For output high voltage (VOH), it should be at least VDD-2.5V when sinking 4mA at 25°C.
Propagation Delay:
- Expect a propagation delay time (tpd) of up to 70ns under typical conditions (VDD = 10V, TA = 25°C).
Power Dissipation:
- Monitor power dissipation, which typically should not exceed 180mW to avoid overheating.
Handling Precautions:
- Handle with care to avoid electrostatic discharge (ESD). Use appropriate ESD protection measures during handling and installation.
Mounting:
- Follow standard surface mount technology (SMT) guidelines for mounting on PCBs to ensure proper electrical connections and thermal management.
Testing:
- Perform initial testing under controlled conditions to verify functionality before integrating into final designs.
(For reference only)
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