Description
BUY TS5A63157DCKRE4 https://www.utsource.net/itm/p/12610076.html
Parameter |
Symbol |
Conditions |
Min |
Typ |
Max |
Unit |
Supply Voltage |
VDD |
Operating |
1.65 |
|
3.6 |
V |
On Resistance |
RON |
VDD = 2.7V, IOUT = 1mA |
0.4 |
|
1.2 |
惟 |
Off Leakage Current |
ILK |
VDD = 0V, VS = 2.5V |
|
|
1 |
nA |
Switching Time |
tSW |
VDD = 2.7V, CL = 10pF |
5 |
|
15 |
ns |
Power Dissipation |
PD |
Continuous |
|
|
480 |
mW |
Operating Temperature |
TOPR |
|
-40 |
|
85 |
掳C |
Storage Temperature |
TSTG |
|
-65 |
|
150 |
掳C |
Instructions for TS5A63157DCKRE4
Supply Voltage (VDD):
- Ensure the supply voltage is within the range of 1.65V to 3.6V to avoid damage and ensure proper operation.
On Resistance (RON):
- The on resistance can vary between 0.4惟 and 1.2惟 depending on operating conditions. Keep this in mind when designing circuits that are sensitive to resistance changes.
Off Leakage Current (ILK):
- When the device is off, the leakage current should not exceed 1nA. This ensures minimal power loss in the off state.
Switching Time (tSW):
- The switching time ranges from 5ns to 15ns under typical conditions. Ensure your application can accommodate these timing parameters.
Power Dissipation (PD):
- The maximum continuous power dissipation is 480mW. Design the circuit board with adequate heat dissipation if operating near this limit.
Operating Temperature (TOPR):
- Operate the device within the temperature range of -40掳C to 85掳C to ensure reliable performance.
Storage Temperature (TSTG):
- Store the device in environments where temperatures range from -65掳C to 150掳C to prevent damage during storage.
Handling Precautions:
- Handle with care to avoid electrostatic discharge (ESD) damage. Use appropriate ESD protection measures when handling or installing the component.
Mounting and Soldering:
- Follow recommended soldering profiles and mounting guidelines provided by the manufacturer to ensure proper installation and functionality.
(For reference only)
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