Description
BUY TD62384AP https://www.utsource.net/itm/p/12610265.html
Parameter |
Symbol |
Conditions |
Min |
Typ |
Max |
Unit |
Supply Voltage |
VCC |
Operating |
1.8 |
- |
5.5 |
V |
Output Current |
IO |
Per output, Ta=25°C |
- |
100 |
- |
mA |
Quiescent Current |
IQ |
VCC = 5V, No load |
- |
1.5 |
- |
mA |
Input Voltage Range |
VIN |
Operating |
0 |
- |
VCC |
V |
Maximum Power Dissipation |
PD |
Ta=25°C |
- |
- |
430 |
mW |
Operating Temperature |
TOPR |
|
-40 |
- |
85 |
°C |
Storage Temperature |
TSTG |
|
-55 |
- |
150 |
°C |
Instructions for TD62384AP
Supply Voltage (VCC):
- Ensure the supply voltage is within the range of 1.8V to 5.5V to avoid damage or malfunction.
Output Current (IO):
- The device can source up to 100mA per output at room temperature (Ta=25°C). Do not exceed this limit to prevent overheating or failure.
Quiescent Current (IQ):
- The typical quiescent current is 1.5mA when the supply voltage is 5V and there is no load. This value helps in power budget calculations.
Input Voltage Range (VIN):
- Inputs should be within the range of 0V to VCC to ensure proper operation and prevent latch-up conditions.
Power Dissipation (PD):
- Keep the power dissipation below 430mW at room temperature (Ta=25°C) to maintain safe operating conditions.
Operating Temperature (TOPR):
- The device is designed to operate between -40°C and 85°C. Operating outside these temperatures may affect performance or reliability.
Storage Temperature (TSTG):
- Store the device between -55°C and 150°C. Avoid exposing the device to temperatures outside this range for extended periods.
Handling:
- Handle with care to avoid static discharge which can damage the sensitive components. Use appropriate ESD protection measures.
Mounting:
- Follow recommended PCB layout guidelines to ensure optimal thermal performance and electrical characteristics. Proper grounding and decoupling capacitors are essential.
(For reference only)
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