Description
BUY FQD11P06TM https://www.utsource.net/itm/p/12610357.html
Parameter |
Symbol |
Min |
Typ |
Max |
Unit |
Description |
Drain-Source On-State Resistance |
RDS(on) |
- |
1.6 |
- |
Ω |
At VGS = 10V, ID = 4A |
Gate-Source Voltage |
VGS(th) |
1.0 |
2.0 |
3.0 |
V |
Gate-source threshold voltage |
Continuous Drain Current |
ID |
- |
- |
11 |
A |
At Tc = 25°C |
Pulse Drain Current |
IDM |
- |
- |
35 |
A |
Pulse duration ≤ 10ms, duty cycle ≤ 1% |
Power Dissipation |
PD |
- |
- |
48 |
W |
At TC = 25°C |
Junction Temperature |
TJ |
-25 |
- |
175 |
°C |
Operating junction temperature range |
Storage Temperature |
TSTG |
-55 |
- |
150 |
°C |
Storage temperature range |
Instructions for FQD11P06TM:
Handling Precautions:
- Avoid exposing the device to excessive temperatures beyond the specified operating and storage ranges.
- Use appropriate ESD (Electrostatic Discharge) protection when handling the component.
Mounting and Soldering:
- Ensure that the mounting surface is clean and free from contaminants.
- Follow recommended soldering profiles to prevent thermal damage. Refer to the manufacturer’s guidelines for specific soldering conditions.
Operation:
- Operate within the specified electrical parameters to ensure reliable performance.
- Ensure proper heat sinking if operating near maximum current or power dissipation limits.
Testing:
- During testing, apply gate voltages carefully to avoid exceeding the VGS(th) limits.
- Verify that all connections are secure and correctly made to avoid short circuits or incorrect operation.
Storage:
- Store in a dry environment within the specified storage temperature range.
- Protect from physical damage during storage and transportation.
For detailed specifications and more information, refer to the official datasheet provided by the manufacturer.
(For reference only)
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