Description
BUY IRLR9343PBF https://www.utsource.net/itm/p/12610839.html
| Parameter |
Symbol |
Test Conditions |
Min |
Typ |
Max |
Unit |
| Drain-Source On-Resistance |
RDS(on) |
VGS = 4.5V, ID = 12A |
- |
3.8 |
- |
mΩ |
| Gate-Threshold Voltage |
VGS(th) |
ID = 250μA |
1.0 |
- |
2.0 |
V |
| Continuous Drain Current |
ID |
TC = 25°C |
- |
30 |
- |
A |
| Gate Charge |
Qg |
VGS = 4.5V, ID = 12A |
- |
9.7 |
- |
nC |
| Input Capacitance |
Ciss |
VDS = 10V, VGS = 0V |
- |
160 |
- |
pF |
| Output Capacitance |
Coss |
VDS = 10V, VGS = 0V |
- |
34 |
- |
pF |
| Total Power Dissipation |
PD |
TC = 25°C |
- |
- |
1.6 |
W |
| Junction Temperature |
Tj |
- |
- |
- |
150 |
°C |
Instructions for Use:
- Handling Precautions: The IRLR9343PBF is sensitive to electrostatic discharge (ESD). Use appropriate ESD protection measures during handling and installation.
- Mounting: Ensure proper mounting to maintain thermal performance. Adequate heatsinking may be necessary depending on the application.
- Gate Drive: Ensure the gate drive voltage (VGS) is within specified limits to avoid damage or unreliable operation. Typical applications use VGS values of 4.5V or higher for optimal performance.
- Thermal Management: Monitor junction temperature to ensure it does not exceed 150°C. Proper cooling solutions should be implemented if operating near maximum power dissipation.
- Storage: Store in a dry, cool environment to prevent moisture damage. Follow recommended storage conditions as outlined by the manufacturer.
- Soldering: Observe standard soldering profiles for surface mount devices to prevent thermal shock and potential damage to the device.
For detailed specifications and more advanced applications, refer to the full datasheet provided by the manufacturer.
(For reference only)
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