Description
BUY IRF7478PBF https://www.utsource.net/itm/p/12611120.html
Parameter |
Symbol |
Min |
Typ |
Max |
Unit |
Conditions |
Drain-Source On-Resistance |
Rds(on) |
- |
12 |
- |
mΩ |
Vgs = 10V, Id = 3.5A, Ta = 25°C |
Gate Threshold Voltage |
Vgs(th) |
1.0 |
- |
2.0 |
V |
Id = 250μA, Ta = 25°C |
Continuous Drain Current |
Id |
- |
- |
3.5 |
A |
Tc = 25°C |
Pulse Drain Current |
Idm |
- |
- |
17 |
A |
Pulse width ≤ 300μs, Duty cycle ≤ 2% |
Total Power Dissipation |
Ptot |
- |
- |
0.8 |
W |
Ta = 25°C |
Junction Temperature |
Tj |
- |
- |
150 |
°C |
- |
Storage Temperature |
Tstg |
-55 |
- |
150 |
°C |
- |
Instructions for Use:
- Handling Precautions: The IRF7478PBF is sensitive to electrostatic discharge (ESD). Handle with care and use proper ESD protection measures.
- Mounting: Ensure good thermal contact with the heat sink if operating at high power levels or in high ambient temperatures.
- Biasing: Apply gate-source voltage within specified limits to avoid damage. Ensure that the gate drive circuitry can provide sufficient current to charge and discharge the gate capacitance quickly.
- Operating Conditions: Do not exceed the maximum ratings listed in the table. Pay particular attention to the junction temperature and power dissipation limits.
- Storage: Store in a dry environment and observe the storage temperature range to prevent damage.
- Testing: When testing the device, ensure that all parameters are within the specified limits to avoid misleading results.
(For reference only)
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