IDT70261S15PF

IDT70261S15PF

Category: Available (Qty:9999999)
For more information, visit our official website at utsource.us

Description

BUY IDT70261S15PF https://www.utsource.net/itm/p/12611378.html

Parameter Description Value Unit
Device Type High-Speed CMOS Synchronous SRAM IDT70261S15PF
Organization x18
Density 2M x 18 36 Mbit
Supply Voltage (Vcc) Operating Voltage 3.3 V
Standby Current Power Supply Current in Standby Mode 5 mA
Active Current Power Supply Current in Active Mode 70 mA
Access Time Random Access Time 10 ns
Cycle Time Minimum Cycle Time 10 ns
Output Drive Capability Output Drive 24mA mA
Package Type Plastic Fine Pitch Ball Grid Array (BGA) 196-Ball BGA
Operating Temperature Industrial Temperature Range -40 to +85 °C
Storage Temperature Storage Temperature Range -65 to +150 °C

Instructions for Use

  1. Power Supply Connection:

    • Connect the Vcc pin to a 3.3V power supply.
    • Ensure proper decoupling capacitors are placed close to the power supply pins to minimize noise.
  2. Signal Integrity:

    • Keep signal traces as short as possible to reduce propagation delays and reflections.
    • Use controlled impedance traces for high-speed signals.
  3. Clock and Control Signals:

    • The device is synchronous; ensure the clock signal is stable and clean.
    • All control signals should be synchronized with the clock.
  4. Initialization:

    • After applying power, allow sufficient time for the device to stabilize before initiating any read/write operations.
  5. Read/Write Operations:

    • For write operations, present the data on the data bus and assert the write enable (WE) signal along with the chip select (CS).
    • For read operations, assert the chip select (CS) and provide the address. Data will be available on the data bus after the access time.
  6. Standby Mode:

    • To enter standby mode, deassert the chip select (CS). This reduces power consumption significantly.
  7. Handling Precautions:

    • Handle the device with care to avoid damage from electrostatic discharge (ESD).
    • Follow recommended guidelines for soldering and PCB layout.
  8. Testing and Verification:

    • Verify all connections and configurations using appropriate test equipment.
    • Perform functional tests to ensure the device operates within specified parameters.

For detailed specifications and further instructions, refer to the official datasheet provided by Integrated Device Technology (IDT).

(For reference only)

More detail about Utsource Holding Company Limited
Utsource Holding Company Limited
Utsource Holding Company Limited Electronic Component Wholesaler, IC Chip Distributor, IGBT Module Supplier in California, USA | Utsource Holding Company Limited