MC9S12XEQ512MAA
MC9S12XEQ512MAA

 

MC9S12XEQ512MAA

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Category: Available (Qty:9999999)
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Description

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Parameter Description Value/Range
Package Type The type of package used for the component. LQFP (Low-Profile Quad Flat Package)
Pin Count Number of pins on the package. 144
Operating Voltage Range of voltage that can be applied to operate the device. 5.0V ± 5%
Temperature Range Operating temperature range. -40°C to +85°C
Flash Memory Size of flash memory available for program storage. 512 KB
RAM Size of RAM available for data storage. 32 KB
CPU Central Processing Unit type. 16-bit HCS12X
Clock Speed Maximum clock speed of the CPU. 40 MHz
ADC Channels Number of Analog-to-Digital Converter channels. 16
Timers Types and number of timers available. 4 x 16-bit
Serial Interfaces Types of serial interfaces supported. SCI, SPI, I2C
CAN Channels Number of CAN (Controller Area Network) channels. 2
PWM Channels Number of Pulse Width Modulation channels. 8
EEPROM Size of EEPROM memory available. No internal EEPROM
Power Consumption Typical power consumption at maximum clock speed. Not specified in brief overview

Instructions:

  1. Power Supply Requirements: Ensure that the operating voltage is within the specified range (5.0V ± 5%). Use appropriate voltage regulators if necessary.
  2. Programming: Use an appropriate programming tool compatible with the MC9S12XEQ512MAA to load programs into the flash memory.
  3. Clock Configuration: Configure the system clock using the internal oscillator or an external crystal as needed for your application.
  4. Peripheral Setup: Initialize peripherals like ADC, timers, and serial interfaces according to the specific requirements of your application.
  5. Thermal Management: Ensure adequate heat dissipation by adhering to the recommended PCB layout guidelines, especially important for applications operating near the upper limit of the temperature range.
  6. Signal Integrity: Pay attention to signal integrity, especially for high-speed signals and sensitive analog inputs.
  7. Testing: After assembly, test the board thoroughly under all expected operating conditions to ensure reliability.

For detailed specifications and more comprehensive instructions, refer to the official datasheet and application notes provided by NXP Semiconductors.

(For reference only)

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