Description
BUY SBA5089Z https://www.utsource.net/itm/p/12612080.html
Parameter |
Symbol |
Min |
Typ |
Max |
Unit |
Description |
Supply Voltage |
VDD |
4.5 |
5.0 |
5.5 |
V |
Operating supply voltage |
Output Current |
IOUT |
- |
1.2 |
1.5 |
A |
Maximum continuous output current |
Efficiency |
η |
85 |
90 |
93 |
% |
Power conversion efficiency |
Switching Frequency |
fSW |
400 |
500 |
600 |
kHz |
Internal switching frequency |
Quiescent Current |
IQ |
70 |
85 |
100 |
μA |
Current consumption in standby |
Shutdown Current |
ISD |
0.1 |
0.5 |
1.0 |
μA |
Current in shutdown mode |
Operating Temperature |
TOPR |
-40 |
25 |
125 |
°C |
Operating ambient temperature range |
Instructions for SBA5089Z:
Power Supply Connection:
- Connect the positive terminal of the power supply to the VDD pin.
- Connect the negative terminal (GND) to the GND pin.
Output Configuration:
- Connect an external inductor and capacitor to the output for filtering.
- Ensure the load is connected between the VOUT pin and GND.
Thermal Considerations:
- Place the device on a suitable heatsink or PCB with adequate copper area for heat dissipation.
- Avoid operating at temperatures exceeding the maximum specified operating temperature.
Enable/Disable Control:
- Use the EN pin to control the operation of the device. High logic level enables the device, low disables it.
Protection Features:
- The device includes overcurrent protection, thermal shutdown, and undervoltage lockout.
- Ensure these features are not activated under normal operating conditions by adhering to the specified limits.
Layout Recommendations:
- Keep the input and output capacitors as close as possible to the device.
- Minimize trace lengths for high-frequency paths to reduce noise and improve performance.
Handling Precautions:
- Handle the device with care to avoid electrostatic discharge (ESD).
- Follow standard ESD handling procedures during assembly and testing.
(For reference only)
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