ADUM6401CRWZ

ADUM6401CRWZ

Category: Available (Qty:9999999)
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Description

BUY ADUM6401CRWZ https://www.utsource.net/itm/p/12612358.html

Parameter Symbol Min Typ Max Unit Description
Supply Voltage VDD1 3.0 5.5 V Supply voltage for Channel 1
Supply Voltage VDD2 3.0 5.5 V Supply voltage for Channel 2
Isolation Voltage VIORM 5.0 kV Maximum repetitive peak isolation voltage
Working Isolation Voltage VIOWM 2.5 kV Maximum working isolation voltage
Propagation Delay tPD 16 22 28 ns Propagation delay, differential input
Pulse Width Distortion tPWD 0.4 1.5 3.0 ns Pulse width distortion
Common Mode Transient Immunity CMR 25 kV/μs Minimum common mode transient immunity
Operating Temperature Range TOPR -40 125 °C Operating temperature range
Storage Temperature Range TSTG -65 150 °C Storage temperature range

Instructions for ADUM6401CRWZ:

  1. Power Supply Configuration:

    • Connect VDD1 and VDD2 to appropriate power supplies within the specified voltage range (3.0V to 5.5V).
    • Ensure proper decoupling capacitors are placed close to the power supply pins.
  2. Signal Routing:

    • Route differential signals carefully to minimize noise and crosstalk.
    • Maintain impedance matching if high-speed signals are used.
  3. Isolation Considerations:

    • Respect the maximum isolation voltage ratings to ensure safe operation.
    • Avoid exceeding the working isolation voltage during normal operation.
  4. Temperature Management:

    • Operate within the specified temperature ranges to ensure reliable performance.
    • Provide adequate heat dissipation if operating near the upper temperature limits.
  5. Handling Precautions:

    • Handle with care as ESD-sensitive components.
    • Follow anti-static precautions when handling or soldering the device.
  6. Testing and Debugging:

    • Use isolated test equipment to avoid damaging the device.
    • Verify all connections and configurations before applying power.
  7. Installation:

    • Ensure proper PCB layout guidelines are followed to maintain signal integrity and isolation effectiveness.
    • Place the component in a location that minimizes exposure to electromagnetic interference (EMI).
(For reference only)

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