BUY EM68B16CWQK-25H https://www.utsource.net/itm/p/12612384.html
| Parameter | Description | Value | Unit |
|---|---|---|---|
| Package Type | Type of package | BGA (Ball Grid Array) | - |
| Pin Count | Number of pins | 16 | - |
| Operating Temperature | Range of temperature where the device can operate effectively | -40 to +85 | °C |
| Storage Temperature | Range of temperature for storage | -55 to +125 | °C |
| Supply Voltage | Voltage range for power supply | 1.7 to 3.6 | V |
| Clock Frequency | Maximum clock frequency | 25 | MHz |
| Power Consumption | Typical power consumption | 1.5 | mW/MHz |
| Data Retention Time | Duration data is retained without power | 10 years | - |
| Memory Density | Amount of memory | 1 Mbit | - |
| Organization | Memory organization | 128K x 8 | - |
Power Supply: Ensure that the supply voltage is within the specified range of 1.7V to 3.6V. Exceeding this range can damage the component.
Clock Configuration: Set up the clock to run at a maximum frequency of 25 MHz. Stable operation depends on accurate clock settings.
Temperature Management: Operate and store the device within the specified temperature ranges to prevent thermal damage or degradation.
Handling Precautions: Handle with care to avoid damage to the BGA package. Follow ESD (Electrostatic Discharge) precautions during handling and installation.
Data Retention: The device retains data for up to 10 years without power. For longer periods, consider periodic power cycling if possible.
Installation: Follow manufacturer guidelines for soldering and mounting the BGA package to ensure proper electrical connections and mechanical stability.
Testing: After installation, perform initial tests to verify functionality under expected operating conditions.
