74HC244P

Category: 74 series Digital Integrated Circuits Available (Qty:9999999)
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Description

BUY 74HC244P https://www.utsource.net/itm/p/6236811.html

Parameter Symbol Min Typ Max Unit Conditions
Supply Voltage VCC 2.0 - 6.0 V
Input Low Voltage VIL -0.5 - 1.5 V VCC = 4.5V to 5.5V
Input High Voltage VIH 3.5 - VCC + 0.5 V VCC = 4.5V to 5.5V
Output Low Voltage VOL -0.5 - 0.1 V IOL = 8 mA
Output High Voltage VOH 2.7 - VCC - 0.2 V IOH = -4 mA
Input Leakage Current IIL -1 - 1 渭A VCC = 4.5V to 5.5V
Output Leakage Current IOL -1 - 1 渭A VCC = 4.5V to 5.5V
Propagation Delay Time tpd - 10 22 ns VCC = 5V, TA = 25掳C
Power Dissipation PD - - 100 mW Per Package
Operating Temperature TA -40 - 85 掳C
Storage Temperature TSTG -65 - 150 掳C

Instructions for Use:

  1. Power Supply:

    • Ensure the supply voltage (VCC) is within the range of 2.0V to 6.0V.
    • Connect the ground (GND) pin to a stable reference point.
  2. Input Signals:

    • Input signals should be within the valid logic levels:
      • Low (VIL): -0.5V to 1.5V
      • High (VIH): 3.5V to VCC + 0.5V
  3. Output Signals:

    • Output signals will be:
      • Low (VOL): -0.5V to 0.1V
      • High (VOH): 2.7V to VCC - 0.2V
  4. Current Handling:

    • The output can sink up to 8 mA and source up to 4 mA.
    • Ensure that the load connected to the output does not exceed these limits.
  5. Propagation Delay:

    • The propagation delay time (tpd) is typically 10 ns at 5V and 25掳C.
    • Consider this delay when designing timing-sensitive circuits.
  6. Temperature Range:

    • The device operates reliably between -40掳C and 85掳C.
    • Store the device between -65掳C and 150掳C.
  7. Handling:

    • Handle with care to avoid static damage.
    • Follow proper soldering techniques to ensure reliable connections.
  8. Testing:

    • Before integrating into a larger system, test the device with known input signals to verify correct operation.
  9. Decoupling Capacitors:

    • Place decoupling capacitors (e.g., 0.1 渭F) close to the power pins to filter out noise and stabilize the power supply.
  10. Layout:

    • Ensure proper PCB layout to minimize signal interference and improve performance.
(For reference only)

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