ECE EDR4

Mobicon - Remote Electronic Sdn Bhd

Kategori: Reed Relays Tersedia

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Penerangan

IC Type
Contact Type:1A
with Diode
Pitch:2.54mm

FEATURES

Mini Sip is a single-in-line Reed Relay using only 12.1x4.3mm of board space which is half the standard SIP requirement.
Epoxy molded single in line structure.
Higher mounting density than DIP type.
Completely washable.

DOWNLOAD SPEC

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Mobicon - Remote Electronic Sdn Bhd Measuring Instruments Selangor, Soldering Iron & Switches Supply Kuala Lumpur (KL), Audio Equipment Supplier Malaysia ~ Mobicon - Remote Electronic Sdn Bhd

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