SHINKAWA UTC-3000 is an advanced bonding equipment designed for use in processes such as high-precision soldering, sealing, and semicondcutor packaging. The system combines multiple technologies in one platform, allowing users to select the most suitable technology quickly and easily for any application. The machine features an extensive list of capabilities, including: Three advanced soldering processes: infrared welding, infrared pre-heating, and temperature-controlled soldering.
Vintage: 2012
