YPC-WD Bend Type Profile Back Cover

YPC-WD Bend Type Profile Back Cover

Kategori: TOUCH SCREEN INDUSTRIAL PANEL PC Tersedia
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Penerangan



Features :
 

Product size 13.3 inches/15.6 inches/18.5 inches/21.5 inches/23.6 inches/27 inches
Touch type Capacitive
Appearance color Black front frame, gray back cover
Motherboard solution DB02 series motherboard
Product material Bent front frame, profile back cover
Ordering Information  (I3/I5/I7) 10th generation series dual network/6*serial ports/4*USB
(I3/I5/I7) 7th generation series B version dual network/6*serial ports/4*USB
(I3/I5/I7) 7th generation series version A single network/2*serial port/4*USB
 

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SEM Equipment Sdn. Bhd.
SEM Equipment Sdn. Bhd. Industrial Equipment Manufacturer, Ultrasonic Equipment Supplier, Laser Equipment Supply in Johor Bahru (JB), Malaysia ~ SEM Equipment Sdn. Bhd.