SENFENG Laser SF3015HM

Micron Machines Technology Sdn Bhd

Category: SENGFENG LASER CUTTING Available

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Description

SF3015HM

Working area 3000x1500mm
X axis travel 3000mm
Y axis travel 1500mm
Laser power 1500w / 2000w / 3000w / 4000w
Maximum velocity of movement 130m/min
X/Y axis positioning accuracy ±0.05mm/m
X/Y axis repeated positioning accuracy ±0.02mm

More detail about Micron Machines Technology Sdn Bhd

Micron Machines Technology Sdn Bhd Okamoto Grinding Machine Malaysia, Sodick EDM Machine Malaysia, Sodick Wire Cut Machine Malaysia, Lifton Magnet Malaysia, Cylindrical Grinder Malaysia ~ Micron Machines Technology Sdn Bhd

Malaysia