Sturdy Metal and Aluminum Structure: Specifically designed for solder paste and red glue printing, providing durability and stability for consistent performance.
Manual Operation: Allows manual positioning, board placement, printing, and board removal, making it ideal for precise, hands-on control.
Flexible Location Modes: Features both side and hole-based location options, with four-sided micrometric adjustments to ensure accurate alignment between the stencil and PCB.
Adjustable Settings: Fully customizable, allowing for manual adjustments to meet a variety of printing requirements.
Adaptable for PCB Thicknesses: Accommodates PCB thicknesses up to 100mm, making it versatile for different positioning modules and board thicknesses.