Product Details
The Keysight i7090 Board Test system is the world’s first massively parallel board test system that supports up to 20 cores to perform tests in parallel on multiple printed circuit board assemblies (PCBAs)
With current in-circuit tester on the market only support up to 4 cores in parallel, PCBA test engineers need to test and purchase more systems to meet manufacturing demands, which incurs scaling and infrastructure costs, a bigger footprint and additional labor for support and maintenance.
Keysight’s i7090 new massively parallel board test system supports up to 20 In-Circuit Test cores in parallel with PCI eXtensions for Instrumentation (PXI) based in-circuit test capability. Therefore, core configuration is variable and not confined to a fixed number of rows, which reduces overall computing costs. To expand functionality, Keysight OpenTAP support enables open platforms for the integration of hardware. As needed and with extensible instrumentation and pin cards, users can easily scale resources.
• 20 parallel cores deliver flexible scalability and configuration, as well as the ability to perform tests on multiple Unit Under Tests (UUTs).
• A small system footprint, 600 mm in width, saves space and cycle time.
• High to ultra high-volume manufacturing reduces system investment and supports production test times as needed.
• Includes unpowered and vectorless test extended performance (nanoVTEP) technologies for component test to gain the benefits of faster test throughput, lower cost fixtures and higher fault coverage.
• Instrument integration with Keysight OpenTAP software, within the same platform, for efficient functional test measurements and PXI support for Keysight and 3rd party instruments.
• Supports multi-platform hardware in a standard 48 cm rack for functional integration.
• Programming function integration provides in-system programming with 160 channels in parallel, increasing system throughput.
i7090 is infused with state-of-the-art Industry 4.0 automation and analytics to deliver unparalleled capability that can be optimized for a broad variety of high-volume PCB assembly manufacturing challenges.
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