Optec LightShot LSV3 - Laser Micromachining

SPECIFICATIONS

• Air-cooled, SFF* excimer laser
• 248 nm or 193 nm wavelengths
• Mask-projection “flat” ablations
• Live, zoom video microscope color viewing
• Pneumatic rotary chuck with collets
• Sub-micron resolution motion control
• Integrated NEMA 12 gas cabinet
• Integrated industrial PC
• Auto-focus software function
• Fume extraction
• Class 1, interlocked, safety enclosure

• Deep-UV laser micromachining yields minimal HAZ (heat affected zone) without debris, residue or oxides.

• No damage to electrode. 
• Flat, uniform beam - removes ~ 1/3 um per shot.
• Confocal performance - when the part is in the laser beam is in focus for rapid processing with high repeatability.  
• Continuously variable demagnification optics amplify the energy density when more power is needed for challenging materials. 
• User friendly software routines make it easy to develop part processing recipes. 
• Precision ablation depth control down to 100nm per shot (material dependent) and energy density control for removing material layer-by-layer. 
• High-definition imaging down to 1.5 µm; submicron part positioning resolution and micron level ablation accuracy